HBM4EU – science and policy for a healthy future

Jun 26, 2024 · ASMPT is reportedly collaborating with the US memory giant to co-develop a TC bonder for use in HBM4 production. Notably, ASMPT has supplied TC bonders to SK Hynix as well and plans to deliver more units later in the year. Micron is also procuring TC bonders from Shinkawa and Hanmi Semiconductor for the production of HBM3e.

As HBM competition heats up, introduction schedule of

Sep 21, 2023 · With the increased prevalence of generative AI, the demand for High Bandwidth Memory (HBM) is rapidly rising, leading to heightened competition in stacking. For HBMs, a higher stack means the ...

Samsung HBM3E Shinebolt memory unveiled, HBM4 …

Oct 22, 2023 · Samsung unveils more details about HBM4 memory development. Samsung also unveiled that it will use more advanced chip manufacturing and packaging technologies for HBM4 memory. While HBM4 specifications haven't even been approved yet, it has been revealed that the industry is looking to use a wider (2,048-bit) memory interface.

SK Hynix, TSMC to collaborate on HBM chips for AI

Apr 20, 2024 · To develop HBM4, TSMC’s “advanced logic process” would be adopted to produce “customized HBM that meets a wide range of customer demand for performance and power efficiency,” SK Hynix said. The two companies would also collaborate to optimize the integration of SK Hynix’s HBM and TSMC’s chip-on-wafer-on-substrate packaging …

：GPU““HBM？ - CSDN

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[News] Samsung Reportedly to Tape out HBM4 with 1c …

Aug 19, 2024 · After forming a new HBM development team within its Device Solutions (DS) Division around July, memory Giant Samsung is now said to have made progress on HBM4, targeting to tape-out the product by the end of this year, a report by TheElec notes. The move is also regarded to be laying the foundation stone for the mass production of its 12 …

SK Hynix says new high bandwidth memory for GPUs on …

Feb 2, 2024 · SK Hynix's sentiment regarding HBM4 seems to be shared by Samsung, which says it is on track to produce HBM4 in 2026. Interestingly, Samsung is also developing customized HBM memory solutions for ...

[News] Memory Titans Vie for Control in HBM …

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SK hynix confirms it will bring next-gen HBM manufacturing …

Apr 4, 2024 · SK hynix late on Wednesday announced that it had decided to build its new advanced memory packaging facility in Indiana, which will start operations in the second half of 2028. Given the timeline ...

SK hynix posts record profits amid global HBM …

Aug 22, 2024 · The entire data center and AI industry uses HBM3 memory, with HBM3e expected to arrive at the end of this year into early 2025. That will be followed by HBM4 later in 2025 and HBM4e in 2026 or beyond.